m ? ? ? @ b ? ? ? ? ? ? l @ i ? n @ q p w y u @ r ? ? ? ? @ r ? n l @ h ? ? ? ? ? l @ t ? ? ? ? @ w w p y y t ? z @ r x q n y x x n t v p p @ @ f ? ? z @ r x q n y x x n t v q u @ @ ? ? ? n ? ? ? ? ? ? ? ? ? n ? ? e r p p u @ m ? ? ? @ b ? ? ? ? ? ? l @ i ? n c m m 0 0 1 4 - b d r n p @ ? ? @ r r n p @ g h ? g ? a ? @ m m i c @ p ? ? ? ? @ a C ? ? ?
3236 scott boulevard santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 2.0 to 22.0 ghz gaas mmic power amplifier advanced product information august 2004 (1 of 3) features ? small size: 45 x 92 mils ? high gain: 11.5 db, nom ? medium power: +25 dbm, typ p1db @14 ghz ? directly cascadable ?fully matched ? unconditionally stable ? single bias operation ? bias control ? phemt technology ? silicon nitride passivation specifications (ta = 25?, vdd = 8v) 1 parameters units min typ max frequency range ghz 2.0 22.0 small signal gain db 10.0 13.5 gain flatness db 0.8 gain variation (-40? to +85?) db 0.35 input return loss db -10.0 output return loss db -9.0 power output (@1 db gain compression) 1 dbm 22.5 p1db variation (over operating frequency) dbm 4.5 p1db variation (-40? to +85?) dbm 0.25 saturated output power dbm 24.0 29.0 second order intercept point @ 10 ghz dbm 48.0 third order intercept point @ 10 ghz dbm 37.5 noise figure db 7.5 current ma 250 295 340 thermal resistance ?/w 33.0 stability 2 unconditionally stable absolute maximum ratings parameter rating drain voltage 7v (min.) / 9v (max.) drain current 350 ma continuous power dissipation 2.8 w input power +20 dbm storage temperature -50? to +150? channel temperature +175? operating backside temperature -40 to (see note 2)? die attach and bonding procedures die attach: eutectic die attach is recommended. for eutec- tic die attach: preform: ausn (80% au, 20% sn); stage temperature: 290?, 5?; handling tool: tweezers; time: 1 min or less. wire bonding: wire size: 0.7 to 1.0 mil in diameter (pre- stressed); thermocompression bonding is preferred over thermosonic bonding. for thermocompression bonding: stage temperature: 250?; bond tip temperature: 150?; bonding tip pressure: 18 to 40 gms depending on size of wire. CMM0014-BD chip diagram notes: 1. tested on celeritek connectorized evaluation board (standard assembly condition detailed on page 3). 2. stability factor measured on-wafer. notes: 1. operation outside these limits can cause permanent damage. 2. calculation maximum operating temperature: tmax = 175?pdis [w] x 33.0) [?].
3236 scott boulevard, santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 CMM0014-BD advanced product information - august 2004 (2 of 3) typical performance (vdd = 8v, 300 ma)
3236 scott boulevard santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 celeritek reserves the right to make changes without further notice to any products herein. celeritek makes no warranty, repres entation or guarantee regarding the suitability of its products for any particular purpose, nor does celeritek assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?ypical?parameters can and do vary in different applications. all operating parameters, including ?ypicals?must be validated for each customer application by customer s technical experts. celeritek doe s not convey any license under its patent rights nor the rights of others. celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the celeritek prod uct could create a situation where personal injury or death may occur. should buyer purchase or use celeritek products for any such unintended or unauthorized application, buyer shall indemnify and hold celeritek and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that celeritek was negligent regarding the design or manufacture of the part. celeritek is a registered trademark of celeritek, inc. celeritek, inc. is an e qual opportunity/affirmative action employer. ordering information the cmm-0014-bd is available in bare die and is shipped in gel pak. part number for ordering package CMM0014-BD bare die CMM0014-BD advanced product information - august 2004 (3 of 3) assembly example note: 1. eutectic attach on at least 30mil thick cuw or cumo carrier is recommend. 2. for evaluation, a 1.4mil wire diameter lithium gold air coil has been used .
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